Published Description:
A market leading organisation are looking to add an exceptional and highly motivated individual to join our packaging/assembly department.
This company develop state-of-the-art complex instrumentation products and are sold all over the world. They are market leaders in their industry and are growing year on year. Due to growth they are looking to add an Packaging Engineer / Senior Engineer Design and assembly of packaged MEMS infra-red sensors. Day to day running of production assembly capabilities; organising and controlling production to ensure all products are supplied into Test on-time, to cost and specification. Physical and data analysis of assembled products to provide feedback for product development, customer applications support and continual improvement.
The Packaging Engineer / Senior Engineer must have:
- Experience of IC or MEMS package design and assembly processes; ideally hands on experience with epoxy die attach (conductive and nonconductive), wire bonding (both Al wedge and Au ball bonding) and various package types
- Good understanding and knowledge of components and materials used in electronic package assemblies, including MSDS
- Experience of constructing costed multi-level Bills of Material
- Experience of procuring from material and component suppliers
- Electronics package design and layout; preferably electro-mechanical and optical
You will get opportunities to further develop your skills and work is a fantastic organisation.
If you believe you have the right skill set and experience for this Packaging Engineer / Senior Engineer job then please send your CV to djump@octagongroup.co.uk
If you’d like to discuss the role before applying, you can call Daniel Jump on 01525 659 123